WHO WE ARE

Welcome on our web page 
We are a small, innovative, research  & developement company. We are located in the Vědeckotechnický park Profesora Lista, which is located near Palackého vrch in Brno. We are mainly engaged in the development, design and implementation of microelectronic structures by using thick-film technology, interconnecting of semiconductor chips, design and implementation of custom circuits for microelectronics (PCB) and R&D  in the areas of sensors, controlling and regulation systems.

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​We are active members of The International Microelectronics and Packaging Society  (IMAPS)

Carriers for experimental semiconductor structures

We design and manufacture special carriers of experimental semiconductor chips and structures.

We have a series of standard produced types of "Chip expanders" that are most frequently requested by our customers.

We also provide custom design and production (expander dimensions and shape of printed motives) according to customers need. Custome design and production is possible since from several pieces (sepending on the size of the carrier).

We are also able to design and implement the most appropriate type of leads for connecting of the chip expander to measuring devices and peripherals.

Contacting of semiconductor chips and structures

Custom chips are bonded by using conductive and non conductive epoxy adhesives.  Interconnection is realized by the Au or AlSi1 wires with diameter from 17.5 to 75 microns.

In the case of uncertain origin or age of the chips we are able to assess their bondability.

​We also carry out destructive and non-destructive quality tests of wire bonds by using pull test on Dage device.